| General Capabilities |
| 1 |
Single/Double Sided |
| 2 |
Multi Layer |
| 3 |
blind and buried via |
| 4 |
Impedance Controlled |
| 5 |
Mic/Laser drill |
| 6 |
Resin Plugging |
| 7 |
carbon , peelable glue |
| Design Capability |
| Item |
Type |
Capability |
| Material |
Normal FR4 TG135 |
KB-6160A,KB-6160 |
| Halogen free material |
Shengyi S1155, Shengyi S1165 |
| High Tg FR4 |
IT180A,FR408,FR408HR,IS410,N4000-13SI |
| Ceramic Particle Filled Laminates |
Rogers4350B,Rogers4003C,25FR,25N |
| PTFE Laminates |
Rogers series,Taconic series,Arlon series |
| PCB Type |
Rigid PCB Type |
Backplane,HDI,High multi-layer blind&buried PCB,
Heavy copper power PCB,Backdrill |
| Finish Treatment |
HASL Lead |
Tin thickness: 1-40 U”, Max size: 26*30inch |
| HASL Lead free |
Tin thickness: 2-40 U”, Max size: 26*30inch |
| ENIG |
Ni: 3-10μm, Au: 0.05-0.1μm, Max size: 24*32inch |
| Hard gold |
0.1-4.0μm, Max size: 24*32inch |
| Immersion silver |
0.2-0.6μm, Max size: 20*24inch |
| Gold finger |
0.2-4.0μm |
| Immersion Tin |
1.0μm-3.0μm, Max size: 20*24inch |
| OSP |
0.2-1.0μm, Max size: 26*35inch |
| Peelable mask |
0.20-0.80mm |
| Carbon |
10-50μm |
| ENEPIG |
Ni: 3-8μm, Pd:0.05-0.15μm, Au: 0.05-0.1μm, Max size: 20*24inch |
| Hole |
Laser drill |
3.15mil(0.08mm),4mil(0.1mm),5mil(0.13mm),6mil(0.15mm) |
| Mechanical drill |
Min. size:6mil(0.15mm) , Max. size:256mil(6.5mm) |
| PTH Hole Tol. |
+/-3mil, Advanced:+/-2mil |
| NPTH Hole Tol. |
+0/-2mil or +2/-0mil |
| Max aspect ratio |
15:1 |
| Depth Tol. Of backdrill |
+/-4mil |
| CounterSink Angle |
82° ,90°,120° |
| Width/Space |
Internal Layer |
3/3mil(0.5oz) , 3/4mil (1oz) , 4.5/5mil(2oz) |
| External Layer |
3/2.8mil(0.33oz) ,3.5/3.5mil(0.5oz),4/4.5mil(1oz) |
| Color |
Internal Layer |
Green matte/glossy, Yellow, Black, Blue, Red, White, Purple |
| External Layer |
White, Yellow, Black, Red |
| Mechanical |
V-cut angle |
20、30、45° |
| Gold finger bevelling |
20、30、45、60° |
| Routing tolerance |
±4mil(+/-0.1mm) , Advanced:+/-3.15mil(+/-0.08mm) |
| Others |
Max finished copper thickness |
Internal layer: 6oz; External layer: 10oz |
| Layer count |
1-34 L |
| PCB thickness |
0.2 – 7mm(No Soldermask); 0.4 – 7mm(Have Soldermask) |
| PCB thickness tolerance |
Thickness＞1mm: ±10%; Thickness≤1mm: ±0.1mm |
| Max finished PCB size |
26×35 inch(2L) ; 22.5*32 inch(4L); 22.5*30inch（≥6L） |
| Impedance tolerance |
±5ohm(＜50ohm); ±10%(≥50ohm) |
